Wafer marking & inking
- High precision of liquid amount and position
- contact-free dispensing technology
- Extreme small marks -> 100 µm
For microelectronic parts, the drop-on-demand technique is relevant as the task of dispensing small structures and adhesive points in the size of one hundred micrometer and smaller is more and more required. This size is comparable to the scale for solder-bumps for bonding semiconductor chips.